BGA 가이드-인텔
BGA 가이드-NS
Design for Manufacturability of Rigid Multi-Layer Boards
생산성 향상을 위한 도통홀 디자인
DFM(Design for Manufacture)에 대해서
High Speed Circuit Board Signal Integrity
PCB-design for improved EMC
high-speed PCB design for the Spartan
What is Characteristic Impedance?
Pin-in-paste application guide
BGA 가이드-AMD
Reduce EMI with proper SI design
Assembly and PCB layout guidelines for QFN packages
USB 2.0 PCB guidelines for the ArcticLink solutions platform
Solder Mask and Trace Recommendations for FBGAs
Assembly and PCB layout guidelines for chip-scale packages
CSiEDA Ver.6 출시!